Product showcase

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March 2003

Wire bonder

The 3470-II automatic wire bonder from Palomar Technologies enables high performance, first-level, gold or aluminum wire interconnect assembly used in military and aerospace applications. The unit enables deep access wedge bonds across 633 in² and offers an accuracy of 0.00025 in. Enhanced control and repeatability is available for bonding complex parts such as compact hybrids, MCM power connections, microwave devices, and microwave tuning. The unit performs ultrasonic or thermosonic wedge bonding using an optional heated work stage.
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