Product showcase

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April 2003

Epoxy system

Master Bond epoxy system EP30LTE-LO features low shrinkage, high dimensional stability, and a low coefficient of thermal expansion. This system has passed ASTM 595 for low outgassing. It is used in applications requiring vacuum compatibility, sealant, or encapsulant. The system offers an easy-to-use 10:1 mix ratio by weight with a room-temperature cure. It bonds to a variety of metals, plastics, ceramics, and glass.
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