High-voltage technology from Alcatel

Compared to the 0.7-micron I2T chip, the 0.35-micron I3T (left) features improved functionality and system integration at up to 60% lower silicon cost and with smaller dimensions.

After supplying the European automotive market for the past three years, Alcatel Microelectronics brings a range of products to the North American market, including its next-generation I3T technology. In November, Alcatel launched I3T, which combines mixed-signal (analog/digital), high-voltage functionality (up to 80 V), complex digital circuitry, and an embedded microcontroller (ARM family) on a single chip. Compared to its 0.7-micron chip I2T technology, the modular, 0.35-micron I3T features improved functionality and system integration at up to 60% lower silicon cost and with smaller dimensions; an area reduction between 10 and 70% allows the module to be placed closer to its application in the vehicle.

It also has a higher gate density of up to 15 K gates/mm² with lower power consumption.

"This new technology represents a tremendous step forward for automotive and computer peripheral applications," said Tony Denayer, Alcatel's General Manager, Automotive and Peripherals. "Alcatel has expertise in IC design for both high-voltage, mixed-signal components, and in high-complexity digital products. By combining both, we have leveraged this knowledge to develop our innovative I3T technology," he said, adding, "The I3T-based circuits will fit the requirements of the new 42-V battery concept perfectly."

I3T will be available in a range of mixed-signal technologies for ASICs (application-specific integrated circuits) and ASSPs (application-specific standard products) used for powertrain, body, and safety applications. Click to enlarge

I3T-based circuits can incorporate 32-bit microcontroller memories, bus protocol controllers, and I/O features. The CMOS- and BiCMOS-based technology features embedded Flash and greater ROM density, RAM, and OTP; improved high-voltage DMOS switches with lower on-resistances (80 milliohm/mm² at 40 V, 130 milliohm/mm² at 60 V, and 160 milliohm/mm² at 80 V); and embedded complex IP blocks such as USB and CAN/LIN controllers. I3T will be available in a range of mixed-signal technologies for ASICs (application-specific integrated circuits) and ASSPs (application-specific standard products) used for powertrain, body, and safety applications, including for headlamp positioning.

Alcatel's customers include automotive suppliers such as Siemens VDO, and its chips are found in GM/Opel, Ford, DaimlerChrysler, Volkswagen and Audi, BMW, Volvo, Renault, and PSA Peugeot Citroën vehicles.

- Ryan Gehm